Scanning Acoustic Microscopy
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Technical characteristics
- Type of microscopeElectronic
Description
Capable to inspect all plastic packages, BGA's Family, Multi Chip Packages, Flip Chip, Ceramic Chip Capacitors, the Scanning Acoustic Microscopy System can perform Multi Layers Slice (MLS-Mode) scanning through utilizing of ultrasonic waves.
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Scanning Acoustic Microscopy
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