MAT - Grinding , Lapping and Polishing Tools
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Description
MAT Inc. was setup on Sept., 1998 Have 12 years experience in design, manufacturing of Lapping and Polishing Machines Applications : the turnkey solution or standalone production machine for Sapphire , LiNbO3, LiTaO3, Quartz , SiC , MEMS, SOI, Optical Devices and HDD Wafer size : from 1” to 12” Can select manual or fully automatic wafer load and unload Can select wax mounting or wax-less mounting Provide the good surface quality like roughness, flatness, TTV and Local TTV
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MAT - Grinding , Lapping and Polishing Tools
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