IStack High Performance High Productivity Die Bonder

For Single and Stack Die Bonding Kulicke & Soffa introduces iStack - the next generation of platform that delivers industry leading throughput and best-in-class yields by leveraging unique advances in functionality. Parallel Processing Unique parallel processing of the pick, transfer and place functions delivers industry leading throughput. Dynamic Calibration Technology Dispense and bond heads are continuously calibrated using a unique integrated target built into the heads. An intermediate staging station with an additional camera provides more precise inspection - ensuring that bond accuracy and distribution remain stable over time. Post Pick Alignment and Inspection In process die inspection eliminate bonding defect dies. Additional Features · Enlarged Process Area · Thin Die Capability (25µm)* · Dual Mode Epoxy Writing and Printing · Front Loading Wafer Handling System