ConnX PlusPS High Speed Wire Bonder
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Description
ConnX PlusPS High Speed Wire Bonder is a second generation ball bonder introduced under the highly successful Power Series, which further increases net productivity setting new standard and bench marks in the Discrete, Low Pin Count and Cost Performance markets. . Features: * Interactive Programmable Look Ahead Vision to ease first time set-up * Power Series Xpress Loop to help increase the productivity of short wire applications * Allows the integration of the optional Dual Mag Optics Kit to support stacked die applications in discrete and low pin count devices * Field upgradable to the ConnX Plus LAPS in order to support an 87mm bondable area * 10% higher UPH (Units Per Hour) over the first generation ConnX ball bonder.
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ConnX PlusPS High Speed Wire Bonder
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